Methods related to implementing surface mount devices with ground paths

ABSTRACT

Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a method for fabricating a radio-frequency module includes providing a packaging substrate, the packaging substrate configured to receive a plurality of components and the packaging substrate including a ground plane. In some embodiments, the method includes mounting a surface mount device on the packaging substrate, and forming or providing a conductive layer over the surface mount device such that the surface mount device electrically connects the conductive layer with the ground plane to thereby provide radio-frequency shielding between first and second regions about the surface mount device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. Non-provisional applicationSer. No. 14/252,717 filed Apr. 14, 2014, entitled APPARATUSES ANDMETHODS RELATED TO GROUND PATHS IMPLEMENTED WITH SURFACE MOUNT DEVICESwhich claims priority to U.S. Provisional Application No. 61/812,610filed Apr. 16, 2013, entitled RADIO-FREQUENCY SHIELD GROUND PATH THROUGHA SURFACE MOUNT DEVICE, and U.S. Provisional Application No. 61/817,295filed Apr. 29, 2013, entitled TIERED PACKAGE-LEVEL RADIO-FREQUENCYSHIELDING, the disclosure of each of which is hereby expresslyincorporated by reference herein in its respective entirety.

BACKGROUND Field

The present disclosure generally relates to shielding of radio-frequencymodules.

Description of the Related Art

Electromagnetic (EM) fields can be generated from or have an undesirableeffect on a region of a radio-frequency (RF) device such as an RFmodule. Such an EM interference (EMI) can degrade the performance ofwireless devices that use such an RF module. Some RF modules can beprovided with EM shields to address such performance issues associatedwith EMI.

SUMMARY

In some implementations, the present disclosure relates to aradio-frequency (RF) module that includes a packaging substrateconfigured to receive a plurality of components. The RF module furtherincludes an RF component mounted on the packaging substrate andconfigured to facilitate processing of an RF signal. The RF modulefurther includes an RF shield disposed relative to the RF component. TheRF shield is configured to provide shielding for the RF component. TheRF shield includes a plurality of shielding-wirebonds and at least oneshielding-component. The at least one shielding-component is configuredto replace one or more shielding-wirebonds.

In some embodiments, the RF module can further include a conductiveracetrack implemented under the plurality of shielding-wirebonds. Theconductive racetrack can be electrically connected to theshielding-wirebonds and a ground plane within the packaging substrate.The RF shield can include the at least one shielding-componentpositioned along a selected edge of the packaging substrate. Theselected edge can be substantially free of shielding-wirebond andconductive racetrack. The selected edge can be substantially free of amargin for accommodating the shielding-wirebond and the conductiveracetrack, thereby reducing the overall lateral area of the packagingsubstrate.

In some embodiments, the shielding-component can include an uppersurface and a conductive feature implemented on the upper surface. Theconductive feature can be electrically connected to a ground plane ofthe RF shield through the shielding-component. An upper portion theconductive feature on the shielding-component can be in electricalcontact with an upper conductive layer of the RF shield. The upperconductive layer can also be in electrical contact with upper portionsof the shielding-wirebonds. The RF module can further include anovermold structure that encapsulates the shielding-wirebonds and atleast a portion of the shielding-component. The overmold structure caninclude an upper surface that exposes the upper portions of theshielding-wirebonds and the upper portion of the conductive feature.

In some embodiments, the shielding-component can include a filterdevice. The filter device can be, for example, a CSSD filter.

In accordance with a number of implementations, the present disclosurerelates to a method for fabricating a radio-frequency (RF) module. Themethod includes providing a packaging substrate configured to receive aplurality of components. The method further includes mounting an RFcomponent on the packaging substrate, with the RF component beingconfigured to facilitate processing of an RF signal. The method furtherincludes forming an RF shield relative to the RF component. The RFshield is configured to provide shielding for the RF component. The RFshield includes a plurality of shielding-wirebonds and at least oneshielding-component. The at least one shielding-component is configuredto replace one or more shielding-wirebonds.

In some embodiments, forming of the RF shield includes mounting the atleast one shielding-component positioned along a selected edge of thepackaging substrate. The selected edge can be substantially free ofshielding-wirebond. The selected edge can be substantially free of amargin for accommodating the shielding-wirebond, thereby reducing theoverall lateral area of the packaging substrate.

In a number of implementations, the present disclosure relates to awireless device that includes an antenna and a module in communicationwith the antenna. The module is configured to facilitate either or bothof transmission and reception of RF signals through the antenna. Themodule includes a packaging substrate configured to receive a pluralityof components. The module further includes an RF component mounted onthe packaging substrate and configured to facilitate processing of an RFsignal. The module further includes an RF shield disposed relative tothe RF component. The RF shield is configured to provide shielding forthe RF component. The RF shield includes a plurality ofshielding-wirebonds and at least one shielding-component. The at leastone shielding-component is configured to replace one or moreshielding-wirebonds.

In accordance with some implementations, the present disclosure relatesto a radio-frequency (RF) module that includes a packaging substrateconfigured to receive a plurality of components and including a groundplane. The RF module further includes a conductive layer implementedover the packaging substrate. The RF module further includes a surfacemount device (SMD) mounted on the packaging substrate. The SMD isconfigured to electrically connect the conductive layer with the groundplane to thereby provide RF shielding between first and second regionsabout the SMD.

In some embodiments, the first region can be on the packaging substrate,and the second region can be outside of the module. In some embodiments,each of the first and second regions can be on the packaging substrate.

In some embodiments, the SMD can include a functional component. Thefunctional component can include an upper connection feature inelectrical contact with the conductive layer, a lower connection featurein electrical contact with the ground plane, and at least oneinterconnection feature configured to electrically connect theconductive layer with the ground plane. The functional component caninclude a functional die such that the upper connection feature includesa metal layer formed on one side of the die. The at least oneinterconnection feature can include at least one through-die conductivevia. The lower connection feature can include a contact feature thatelectrically connects the through-die conductive via with the groundplane. The die can include a radio-frequency (RF) filter such as a chipsize surface acoustic wave (SAW) device (CSSD). The die can be mountedon the surface of the packaging substrate in an orientation that isinverted relative to its designed usage orientation.

In some embodiments, the module can be substantially free ofshielding-wirebonds. In some embodiments, the module can include aplurality of shielding-wirebonds configured to provide shieldingfunctionality with the SMD.

In a number of implementations, the present disclosure relates to amethod for fabricating a radio-frequency (RF) module. The methodincludes providing a packaging substrate, where the packaging substrateis configured to receive a plurality of components and includes a groundplane. The method further includes mounting a surface mount device (SMD)on the packaging substrate. The method further includes forming orproviding a conductive layer over the SMD such that the SMD electricallyconnects the conductive layer with the ground plane to thereby provideRF shielding between first and second regions about the SMD.

In some embodiments, mounting of the SMD can include inverting the SMDfrom its designed usage orientation. The SMD can include a conductivefeature that faces upward and in electrical contact with the conductivelayer in the inverted orientation.

According to some implementations, the present disclosure relates to awireless device that includes an antenna and a module in communicationwith the antenna. The module is configured to facilitate processing ofan RF signal through the antenna. The module includes a packagingsubstrate configured to receive a plurality of components and having aground plane. The module further includes a conductive layer implementedover the packaging substrate. The module further includes a surfacemount device (SMD) mounted on the packaging substrate. The SMD isconfigured to electrically connect the conductive layer with the groundplane to thereby provide RF shielding between first and second regionsabout the SMD.

In some implementations, the present disclosure relates to a method forforming a conduction path for a radio-frequency (RF) module. The methodincludes identifying a location of a surface mount device (SMD) mountedon a packaging substrate and encapsulated by an overmold. The methodfurther includes forming an opening through the overmold at the locationover the SMD, such that the opening has sufficient depth to expose atleast a portion of a surface of the SMD. The method further includesforming a conforming layer over the overmold, such that the conforminglayer fills at least a portion of the opening to provide a conductionpath between a portion of the conductive layer outside of the openingand the surface of the SMD.

In some embodiments, each of the conforming layer and the exposedportion of the surface of the SMD can include a conductive layer, suchthat the conduction path includes an electrical conduction path. Theforming of the opening can include ablating the overmold with a laser.The forming of the conforming layer can include applying metallic paint.

In accordance with some implementations, the present disclosure relatesto a method for fabricating a radio-frequency (RF) module. The methodincludes providing a packaging substrate configured to receive aplurality of components. The method further includes mounting a surfacemount device (SMD) on the packaging substrate, with the SMD including ametal layer that faces upward when mounted. The method further includesforming an overmold over the packaging substrate such that the overmoldcovers the SMD. The method further includes forming an opening throughthe overmold at a region over the SMD to expose at least a portion ofthe metal layer. The method further includes forming a conductive layerover the overmold, such that the conductive layer fills at least aportion of the opening to provide an electrical path between theconductive layer and the metal layer of the functional component.

In some embodiments, the forming of the opening can include ablating theovermold with a laser. The forming of the conductive layer can includeapplying metallic paint.

In some embodiments, the method can further include forming, prior toforming of the overmold, a shielding-wirebond on the packagingsubstrate. The shielding-wirebond can have a height that is greater thanthe height of the SMD. The overmold can have a height that issubstantially equal to or greater than the height of theshielding-wirebond.

In some embodiments, the method can further include removing, prior toforming of the opening, an upper portion of the overmold to expose a topportion of the shielding-wirebond but still cover the SMD. The removingof the upper portion of the overmold can include an ablation processsuch as a micro-ablation process.

In some embodiments, the method can further include removing, afterforming of the opening, residue resulting from the formation of theopening. The removing of the residue can also result in additionalmaterial being removed from the overmold to thereby further expose theshielding-wirebond. The removing of the residue can include an ablationprocess such as a micro-ablation process.

In some embodiments, the method can further include cleaning, prior toforming of the conductive layer, the exposed surfaces of the overmoldand the metal layer of the SMD.

In some embodiments, the SMD can include a functional component. Thefunctional component can be configured to facilitate processing of an RFsignal.

According to a number of implementations, the present disclosure relatesto a radio-frequency (RF) module that includes a packaging substrateconfigured to receive a plurality of components, and a surface mounddevice (SMD) mounted on the packaging substrate. The SMD includes ametal layer that faces upward when mounted. The RF module furtherincludes an overmold formed over the packaging substrate, with theovermold being dimensioned to cover the SMD. The RF module furtherincludes an opening defined by the overmold at a region over the SMD,with the opening having a depth sufficient to expose at least a portionof the metal layer. The RF module further includes a conductive layerformed over the overmold. The conductive layer is configured to fill atleast a portion of the opening to provide an electrical path between theconductive layer and the metal layer of the SMD.

In some embodiments, the SMD can include a functional component. Thefunctional component can include an RF filter formed on a die. The RFfilter can include a plurality of through-die conductive vias, with atleast some of the conductive vias being electrically connected to themetal layer and contact features on a lower side of the RF filter. Thecontact features on the lower side of the RF filter can be electricallyconnected to a ground plane of the packaging substrate, such that theconductive layer above the overmold is electrically connected to theground plane through the RF filter. In some embodiments, the RF modulecan further include a plurality of shielding-wirebonds disposed relativeto the RF filter, with the shielding-wirebonds being configured tofacilitate electrical connections between the conductive layer and theground plane.

In some embodiments, the opening can include a side wall having achamfer profile such that an angle between the side wall and a surfaceof the overmold has a value greater than 90 degrees to therebyfacilitate an improved conformity as the conductive layer transitionsbetween the opening and the surface of the overmold. The conductivelayer can include, for example, a layer formed by metallic paint.

In a number of implementations, the present disclosure relates to awireless device having an antenna and a module in communication with theantenna. The module is configured to facilitate either or both oftransmission and reception of RF signals through the antenna. The moduleincludes a packaging substrate configured to receive a plurality ofcomponents. The module further includes a surface mount device (SMD)mounted on the packaging substrate. The SMD includes a metal layer thatfaces upward when mounted. The module further includes an overmoldformed over the packaging substrate, with the overmold being dimensionedto cover the SMD. The module further includes an opening defined by theovermold at a region over the SMD, such that the opening has a depthsufficient to expose at least a portion of the metal layer. The modulefurther includes a conductive layer formed over the overmold. Theconductive layer is configured to fill at least a portion of the openingto provide an electrical path between the conductive layer and the metallayer of the SMD.

In some embodiments, the SMD can be a functional component. Thefunctional component include, for example, an RF filter. The wirelessdevice can be a cellular phone configured to operate in a cellular bandassociated with the RF filter.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

The present disclosure relates to U.S. patent application Ser. No.14/252,719, titled “APPARATUS AND METHODS RELATED TO CONFORMAL COATINGIMPLEMENTED WITH SURFACE MOUNT DEVICES,” filed on Apr. 14, 2014 andhereby incorporated by reference herein in its entirety.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts a radio-frequency (RF) module having an RF shield.

FIG. 2 shows a process that can be implemented to fabricate an RF modulehaving one or more features as described herein.

FIGS. 3A-3C show examples of how one or more RF components can bepositioned on an RF module to provide shielding functionality.

FIG. 4 shows an example module having a conductive racetrack thatextends around the entire perimeter of a packaging substrate, andshielding wirebonds implemented on such a conductive racetrack.

FIG. 5 shows an example module that includes similar components as inFIG. 4; however, one side of the module is shielded by RF components,thereby allowing a portion of the racetrack and the correspondingshielding wirebonds to be omitted.

FIGS. 6A-6C show examples of shielding-wirebonds that can be implementedin an RF module.

FIGS. 7A-7D show various examples of how a grounding connection can bemade through one or more shielding-components.

FIG. 8A shows an example configuration of a module where intra-module RFshielding can be implemented with one or more shielding-components.

FIG. 8B shows a more specific example of the shielding configuration ofFIG. 8A.

FIG. 9A depicts a sectional view of an example functional component thatcan be utilized as a shielding-component of FIGS. 8A and 8B.

FIG. 9B shows the functional component of FIG. 9A mounted on a packagingsubstrate in an intended usage orientation.

FIG. 10A shows that in some implementations, a functional componentsimilar to the die of FIG. 9A can be inverted for mounting.

FIG. 10B shows a mounted configuration where the inverted die is mountedon a packaging substrate.

FIG. 10C shows an example packaged configuration where overmold materialis shown to laterally surround the mounted die of FIG. 10B.

FIG. 11A depicts an example configuration for providing an electricalconnection between a conductive layer on an RF module and ashielding-component.

FIG. 11B depicts a shielding electrical path that can be provided by theconfiguration of FIG. 11A.

FIGS. 12A-12E show an example of how an opening formed through anovermold layer can allow formation of an electrical connection between aconductive layer of an RF module and a conductive layer of ashielding-component.

FIGS. 13A-13F show an example of how techniques such as laser ablationcan be utilized to form an opening through an overmold to facilitate anelectrical connection between a conductive layer of a module and a metallayer of a shielding-component.

FIG. 14 shows a process that can be implemented to effectuate theexample module-fabrication stages of FIGS. 13A-13F.

FIGS. 15A-15C show examples of arrangements of one or more openings thatcan be implemented to facilitate electrical connections as describedherein.

FIG. 16 depicts an example wireless device having one or moreadvantageous features as described herein.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

Disclosed herein are various devices and methods for providingradio-frequency (RF) isolation or shielding for an active or a passiveRF device. For the purpose of description, it will be understood that RFcan include electromagnetic signals having a frequency or a range offrequencies associated with wireless devices. RF can also includeelectromagnetic signals that radiate within an electronic device,whether or not such an electronic device operates as a wireless device.RF can also include signals or noises typically associated withelectromagnetic interference (EMI) effects.

For the purpose of description it will be understood that such an RFdevice can include a device configured to operate at an RF range tofacilitate transmitting and/or receiving of RF signals, and a devicethat can influence another device by, or be influenced by, RF signals ornoises. Non-limiting examples of such an RF device can include asemiconductor die with or without an RF circuitry. Non-limiting examplesof such an RF-related device can include discrete devices such asinductors and capacitors, and even a length of a conductor.

For the purpose of description, it will be understood that the termsisolation and shielding can be used interchangeably, depending on thecontext of usage. For example, an RF device being shielded can involve asituation where an RF signal from another source is being partially orfully blocked. In another example, an RF device being isolated caninvolve a situation where an RF signal (e.g., noise and/or activelygenerated signal) is being partially or fully blocked from reachinganother device. Unless the context of usage specifically statesotherwise, it will be understood that each of the terms shielding andisolation can include either or both of the foregoing functionalities.

FIG. 1 depicts an RF module 100 having an RF shield 102. The RF shield102 is shown to include a portion 104 where one or more components canbe positioned and/or configured to provide shielding functionality.Various examples of how such a component-portion can be configured aredescribed herein in greater detail.

In FIG. 1, the example module 100 can include a packaging substrate 120(e.g., a laminate substrate) configured to receive a plurality ofcomponents. Such components can include, for example, a die 122 havingan integrated circuit (IC) such as an RF circuit. One or more surfacemount devices (SMDs) 124 can also be mounted on the packaging substrate120 to facilitate various functionalities of the module 100. In someembodiments, the module 100 can further include an overmold structurethat encapsulates some or all of the RF shield 102, component-portion104, die 122, and SMD 124.

FIG. 2 shows a process 110 that can be implemented to fabricate a module(e.g., module 100 of FIG. 1) having one or more features as describedherein. In block 112, an RF component can be provided. In block 114, theRF component can be positioned and mounted on a packaging substrate toprovide RF shielding functionality along with shielding-wirebonds. Suchshielding-wirebonds can be formed before or after the mounting of theRF-component. Examples of such positioning of the RF-component aredescribed herein in greater detail. In block 116, one or more groundingconnections that facilitate the RF-shielding functionality can beformed. Examples of such grounding connections are described herein ingreater detail. Although various examples are described herein in thecontext of shielding-wirebonds, it will be understood that one or morefeatures of the present disclosure can also be implemented without suchshielding-wirebonds, with other types of RF-shielding technologies,without any other shielding technologies, or any combination thereof.

FIGS. 3A-3C show non-limiting examples of how one or more RF components130 can be positioned to form one or more shielding-portions 104 at ornear a periphery of a module 100. Such shielding-portions, along with aplurality of shielding-wirebonds 106, can form an RF shield and provideRF shielding between locations inside and outside of the RF shield.Although described in the context of RF shielding of a region generallysurrounded by the RF shield, it will be understood that one or morefeatures of the present disclosure can also be implemented so as toprovide RF shielding between two regions that are both on the module100.

FIG. 3A shows that in some embodiments, a shielding-portion 104 can beprovided on a selected side along a perimeter of a module 100. Theremaining sides of the perimeter can be provided with a plurality ofshielding-wirebonds 106. The example shielding-portion 104 is shown toinclude first and second components 130 a, 130 b. There can be more orless number of components in the shielding-portion 104. Such componentscan be active RF components, passive components, or some combinationthereof.

FIG. 3B shows that in some embodiments, more than one side of a module100 can be provided with shielding-portions 104 a, 104 b. In theexample, the first shielding-portion 104 a is shown to include first andsecond components 130 a, 130 b; and the second shielding-portion 104 bis shown to include one component 130 c. There can be more or lessnumber of components in each of the shielding-portions 104 a, 104 b.Such components can be active RF components, passive components, or somecombination thereof. In the example of FIG. 3B, the remaining sides ofthe perimeter can be provided with a plurality of shielding-wirebonds106.

FIG. 3C shows that in some embodiments, a shielding-portion 104 does notnecessarily need to occupy an entire side. For example, ashielding-portion 104 having a component 130 is shown to be positionedalong a selected side, with shielding-wirebonds 106 on both left andright of the component 130. It will be understood that in someembodiments, such shielding-wirebonds 106 can be provided on the left orright of the component 130. Further, a given side of a module can beprovided with more than one components (active, passive, or somecombination thereof); and such components can be positioned with orwithout one or more shielding-wirebonds along that side.

In some implementations, use of one or more shielding-components inplace of one or more shielding-wirebonds can provide advantageousfeatures such as a reduction in area of modules. For example, consideran RF shielding configuration where shielding-wirebonds are connected toa ground plane through a conductive racetrack that runs alongsubstantially the entire perimeter of a module. Such a configurationtypically needs a margin along the perimeter to accommodate theconductive racetrack and the shielding-wirebonds. Thus, by providing oneor more components along a given side of a module and forming groundingconnections facilitated by such components, the racetrack and thecorresponding shielding-wirebonds can be removed from the given side.Since the margin is no longer needed along the given side, that portionof the module can be removed thereby reducing the overall lateral areaof the module.

By way of examples, FIG. 4 shows an example module 140 having aconductive racetrack 144 that extends around the entire perimeter of apackaging substrate 142. A plurality of shielding-wirebonds 106 areshown to be provided along the lines defined by the racetrack 144.Within the boundary defined by the racetrack 144 are shown variouscomponents, including an integrated circuit (IC) die 122 and filters 130a, 130 b. As described herein, desired or needed margins outside of theracetrack 144 contribute to the overall lateral dimensions of d1×d2 forthe packaging substrate 142.

In FIG. 5, an example module 150 is shown to include similar components(e.g., IC die 122 and filters 130 a, 130 b) as in FIG. 4. However, whilethree of the four sides of a packaging substrate 152 include a racetrack154 and a plurality of shielding-wirebonds 106, the fourth side 156(right side in the example of FIG. 5) of the packaging substrate 152does not include a racetrack or shielding-wirebonds. Accordingly, thefourth side 156 does not need a margin that are present in the otherthree sides. Thus, the region that would have been needed for thefourth-side racetrack and shielding wirebonds can be removed from thepackaging substrate 152.

In the particular example of FIG. 5, the dimension d2 can be generallythe same as the example of FIG. 4. However, the dimension d1 of FIG. 4can now be reduced by Δd to yield a reduced dimension d3. In someembodiments, such a reduced amount Δd can be generally the area neededto implement the fourth-side racetrack and correspondingshielding-wirebonds.

In the particular example of FIG. 5, the filters 130 a, 130 b can be,for example, chip size SAW (surface acoustic wave) devices (CSSDs) suchas commercially available Taiyo Yuden CSSD filters. Each of filters caninclude or be provided with a grounded top surface, and such a groundedtop surface can be utilized to form one or more electrical connectionsto facilitate RF shielding functionality.

In some implementations, RF shielding-wirebonds 106 utilized along withshielding-components 130 as described herein can be configured in anumber of ways. FIGS. 6A-6C show non-limiting examples of suchshielding-wirebonds 106. In FIG. 6A, a shielding-wirebond 106 having adeformable configuration is shown to be formed on bond pads 52 a, 52 bthat are on a packaging substrate 54 (e.g., laminate substrate).Additional details concerning such a wirebond configuration areavailable in International Publication No. WO 2010/014103 (InternationalApplication No. PCT/US2008/071832, filed on Jul. 31, 2008, titled“SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCE SHIELDING AND METHODOF MANUFACTURE THEREOF”) the disclosure of which is incorporated hereinby reference in its entirety.

In FIG. 6B, an arch shaped shielding-wirebond 50 is shown to be formedon bond pads 52 a, 52 b that are on a packaging substrate 54 (e.g.,laminate substrate). Additional details concerning such a wirebondconfiguration are available in U.S. Pat. No. 8,399,972, titled“OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMISHIELDING” the disclosure of which is incorporated herein by referencein its entirety.

FIG. 6C shows that in some embodiments, shielding-wirebonds do not needto be curved or have ends that begin and end on the packaging substrate.A wirebond structure 106 that begins on the packaging substrate 54 andends at a location above the packaging substrate 54 is shown to beformed on a bond pad 52. Additional details concerning such a wirebondconfiguration are available in the above-referenced U.S. Pat. No.8,399,972. Other configurations of shielding-wirebonds can also beutilized.

FIGS. 7A-7D show various non-limiting examples of how a groundingconnection can be made through one or more shielding-components 130. Inan example configuration 160 of FIG. 7A, a shielding-component 130(e.g., an RF filter) is depicted as being mounted on a packagingsubstrate 56 through contact pads 162 a, 162 b. At least one of suchcontact pads can be a grounding pad electrically connected to a groundplane within the packaging substrate. An upper surface of theshielding-component 130 is shown to include a conductive layer 164. Insome embodiments, such a conductive layer 164 can be electricallyconnected to the grounding pad, and thereby to the ground plane.

Positioned relative to the shielding-component 130 is an exampleshielding-wirebond 106 formed on bond pads 52 a, 52 b. As described inthe above-referenced U.S. Pat. No. 8,399,972, such bonding pads can beelectrically connected to the ground plane within the packagingsubstrate. As also described in the above-referenced U.S. Pat. No.8,399,972, an upper portion 58 of the shielding-wirebond 106 can beexposed from an overmold structure 56 so as to allow formation of anelectrical connection with a conductive layer 60. Such an arrangement ofthe conductive layer 60, the shielding-wirebond 106, and the groundplane allows shielding of RF signals, RF noise, electromagneticinterference (EMI), etc. between an inner region and an outer region,and/or between selected regions within the boundary of a module.

As shown in FIG. 7A, the conductive layer 60 can be in electricalcontact with the conductive layer 164 of the shielding-component 130.Accordingly, the foregoing shielding arrangement can be extended to aregion where the shielding-component 130 replaces one or moreshielding-wirebonds 106.

In the example shown, the height of the upper surface of the conductivelayer 164 is depicted as being h. In some implementations, theshielding-wirebond 106 can be dimensioned appropriately so that itsheight is also approximately h.

In the example of FIG. 7A, the conductive layer 164 is depicted as asingle layer that extends laterally to substantially cover theshielding-component 130. FIG. 7B shows that in some embodiments, such aconductive layer does not need to cover the entire upper portion of theshielding-component 130. In an example configuration 170, a conductivelayer 174 is shown to cover only a portion of the upper surface of theshielding-component 130. The remaining areas are shown to be covered bythe overmold structure.

In some embodiments, each of the conductive layers 164, 174 of FIGS. 7Aand 7B can be a single contiguous piece. In some embodiments, each ofthe conductive layers 164, 174 can include a plurality of conductivefeatures electrically connected to a grounding pad. Other configurationscan also be implemented.

FIG. 7C shows that in some embodiments, heights of a shielding-wirebondand a shielding-component do not need to be the same. In an exampleconfiguration 180, a shielding-wirebond 106 is depicted as having aheight of h1, and an upper surface of a conductive layer 164 above ashielding-component 130 is depicted as having a height of h2 which isless than h1. Such a configuration can arise, for example, when theshielding-component 130 has a relatively low profile.

If the height difference h3 (h1 minus h2) is sufficiently large, it maynot be desirable or practical to form an electrical connection betweenthe conductive layers 60 and 164 through a solid conductive layer. Toform an electrical connection, one or more reduced-sizeshielding-wirebonds 182 can be provided on the conductive layer 164,such that top portions 184 of the wirebonds 182 are in electricalcontact with the conductive layer 60. In some embodiments, the shape ofthe reduced-size shielding-wirebonds 182 can be similar to that of theshielding-wirebond 106. In some embodiments, the two shapes can bedifferent.

FIG. 7D shows that in some embodiments, the extra height which isbridged by a plurality of reduced-size shielding-wirebonds 182 in theexample of FIG. 7C, can also be occupied in other manners. In an exampleconfiguration 200, an additional shielding-component 202 is shown to bepositioned above the shielding-component 130. A conductive layer 206 onan upper surface of the additional component 202 is shown to be inelectrical contact with the conductive layer 60, and the conductivelayer 206 can be electrically connected to a grounding pad (e.g., eitheror both of pads 204 a, 204 b). The pads 204 a, 204 b are shown to be inelectrical contact with corresponding conductive layers 164 a, 164 b.Either or both of the conductive layers 164 a, 164 b can be electricallyconnected to a ground plane as described herein.

In some embodiments, the additional component 202 can be an active orpassive device that facilitates the operation of the module. In someembodiments, the additional component 202 can be a dummy deviceconfigured to provide the foregoing electrical bridge between theconductive layers 60 and 164.

In the various examples described in reference to FIGS. 1-7, RFshielding functionality includes some combination of one or moreshielding-components (130) and a plurality of shielding-wirebonds (106).Further, some of such combinations are described in the context ofgenerally surrounding a region on a packaging substrate so as to provideRF shielding functionality between inside and outside of such a region.

As described herein, it will be understood that one or more featuresassociated with use of shielding-components (130) can be implemented inother configurations. For example, one or more shielding-components(130) can be implemented (with or without shielding-wirebonds) toprovide RF shielding between first and second regions of the same modulewithout having to define a generally enclosed region. In configurationswhere such intra-module RF shielding does not includeshielding-wirebonds, use of needed components as shielding-componentsand absence of shielding-wirebonds can make the packaging process moreefficient and cost-effective.

FIG. 8A shows an example configuration of a module 100 whereintra-module RF shielding can be implemented with one or moreshielding-components 130. The three example shielding-components 130 a,130 b, 130 c are shown to provide an RF shield 210 between a firstregion “A” and a second region “B,” with both regions being parts of thesame module 100. In the example shown, the module 100 does not includeany shielding-wirebonds. However, shielding-wirebonds can be implementedto provide, for example, RF-shielding between locations within andoutside of the module 100.

FIG. 8B shows a more specific example of the intra-module shieldingconfiguration of FIG. 8A. An example front-end module (FEM) 100 is shownto include a power amplifier (PA) die having a PA circuit configured toprovide multi-mode multi-band (MMMB) capability. Operation of such a PAcircuit in different cellular bands and/or different modes can befacilitated by one or more band switches, various filters, variousduplexers, and an antenna switch.

In the example shown in FIG. 8B, suppose that a band switch 212 locatedat one region (e.g., region A) radiates RF signal and/or noise to impactoperation of a duplexer 214 (e.g., a B4 band duplexer) located atanother region (e.g., region B). Such known pair of components can beseparated to the extent possible or practical within the module;however, it may be desirable to shield the B4 duplexer 214 from theradiated RF signal/noise from the band switch 212.

In some embodiments, RF filter devices can be utilized asshielding-components. For example, some or all of filters such as B1filter 130 a, B3 filter 130 b, B25 filter 130 c and B17 filter can bepositioned and configured as described herein to provide intra-moduleshielding functionality. In the example shown in FIG. 8, the B1 filter130 a and the B3 filter 130 b can be positioned about the B4 duplexer214 so as to provide RF shielding from the influence of the RF radiation(depicted as an arrow 216) from the band switch 212.

In some embodiments, some or all of the shielding-components 130 ofFIGS. 8A and 8B can be functional components. For the purpose ofdescription, it will be understood that a functional component caninclude a device (active or passive) that is part of the module's RFdesign and therefore provides some RF-related function. As describedherein, a filter device such as a CSSD filter can be such a functionalcomponent. It will also be understood that a functional component caninclude a device (active or passive), which may or may not be part ofthe module's RF design, that includes connection features through thedevice, about the device, or some combination thereof. For example, andas described herein in greater detail, such a device can includethrough-substrate-vias that provide, or are capable of providing,electrical connection paths between two opposing sides of the device. Itwill be understood that the foregoing components can also be utilized asthe shielding-components described herein in reference to FIGS. 1-7.

FIG. 9A depicts a sectional view of an example functional component 130that can be utilized as one of the functional components of FIGS. 8A and8B. In FIG. 9A, the functional component 130 is oriented in its intendedconventional usage, where a metal layer 228 on one side of a diesubstrate 220 is facing down for mounting to a packaging substrate 232(FIG. 9B). In some embodiments, such a metal layer (228) may be utilizedduring die fabrication; however, the metal layer 228 may or may not beutilized in the finalized die. In some embodiments, the metal layer 228can function as a ground for the die.

The other side of the die substrate 220 is shown to include a pluralityof electrical contact pads 226 a, 226 b, 226 c. Some of such contactpads (e.g., 226 a, 226 b) can be utilized for signals, power, etc.; andsome (e.g., 226 c) can be utilized as a grounding contact.

As further shown in FIG. 9A, the functional component 130 can include aplurality of through-die vias 222 a, 222 b, 222 c, 222 d. In someembodiments, such vias can be configured to provide, for example,electrical connection between the two sides of the die, heat conductionpath(s), or some combination thereof. In some embodiments, some of suchvias may be utilized during die fabrication, but may be unused in thefinalized die. In the example shown, via 222 c is shown to provide anelectrical connection between the contact pad 226 c and the metal layer228 (e.g., to provide a grounding connection). The other vias (222 a,222 b, 222 d) can be utilized to conduct heat to the metal layer to bedissipated away from the die.

In an example mounted configuration 230 of FIG. 9B, the metal layer 228can be secured (e.g., soldered) to a grounding pad 236 so as tophysically mount the die and provide electrical connection between thedie's ground to the module's ground. Non-ground contact pads (e.g., 226a, 226 b) of the die can be electrically connected to their respectivecontact pads (e.g., 234 a, 234 b) on the packaging substrate 232.

FIG. 10A shows that in some implementations, a functional component 130substantially the same or similar to the die of FIG. 9A can be invertedso that the metal layer 228 now faces up. FIG. 10B shows a mountedconfiguration where the inverted die is mounted on a packaging substrate252. In some embodiments, the packaging substrate 252 can be configuredwith contact pads (e.g., 254 a, 254 b, 254 c) to facilitate physicalmounting (e.g., by solders) and electrical connections with theirrespective contact pads (e.g., 226 a, 226 b, 226 c) of the die. Thecontact pads 254 a, 254 b, 254 c can be electrically connected to theirrespective module-terminals or module-ground through various connectionfeatures (not shown) within the packaging substrate 252 (e.g., alaminate substrate).

As further shown in FIG. 10B, the vias (e.g., 222 a, 222 b, 222 d) thatare not connected in the foregoing manner can be electrically groundedby, for example, one or more ball joints 256 that are in turnelectrically connected (not shown) to the module-ground. In someembodiments, such a module-ground can include one or more ground planesthat provide RF shielding functionality below the surface of thepackaging substrate 252.

FIG. 10C shows an example packaged configuration 260 where an overmoldmaterial 262 is shown to laterally surround the mounted die. Further, ametal layer 264 is shown to be formed or provided over the overmold 262(e.g., as described in reference to FIG. 7) and in electrical contactwith the metal layer 228 of the die.

As shown in FIG. 10C, the metal layer 264 is in electrical contact withthe grounding plane(s) within the packaging substrate 252 through themetal layer 228 of the die, one or more of the through-die conductivevias (e.g., 222 a, 222 b, 222 c, 222 d), and their respectivedie-to-packaging substrate connection features (e.g., 256, 226 c, 254c). As shown, the conductive vias 222 a, 222 b, 222 c, 222 d can providelateral RF shielding functionality (e.g., intra-module shielding betweenregions A and B in FIGS. 8A and 8B) which can be enhanced by theelectrically connected upper (metal layer 264) and lower (groundingplane(s)) shielding planes.

In the examples shown in FIGS. 10A-10C, one can see that the functionalcomponent 130 (e.g., a CSSD filter die) can provide dualfunctionalities—one for filtering, and another for providing RFshielding. It is also noted that the inverted-mounting configuration canalso remove the need to electrically connect the contact pads of thefunctional component 130 with connection-wirebonds. In some situations,such absence of connection-wirebonds can be advantageous. In someembodiments, and as described herein, a shielding-component as describedherein can be a component that provides or facilitates an electricalconnection for shielding functionality, as well as be a functional partof a circuit associated with the corresponding module. Use of such ashielding-component for dual purpose can allow, for example, reductionor optimization of space needed by the module.

As described herein, there may be situations (e.g., examples of FIGS. 7Cand 7D) where the height of an overmold structure is greater than theheight of a shielding-component. FIG. 11A depicts an exampleconfiguration 500 for providing an electrical connection 510 between aconductive layer 264 on an RF module 100 and a shielding-component 130.As described herein, such an electrical connection can be formed througha layer of an overmold structure 262 that encapsulates theshielding-component 130. The shielding-component 130 is shown to bemounted on a packaging substrate 252 that includes a ground plane 504.With the electrical connection 510 between an electrical node Aassociated with the conductive layer 264 and the shielding-component130, an electrical path 502 (see FIG. 11B) can be formed between node Aand node B associated with the ground plane 504. Such an electrical pathcan include the conductive layer 264, the electrical connection 510, oneor more electrical paths on, around and/or through theshielding-component 130, one or more electrical connections between theshielding-component 130 and the packaging substrate 252, and one or moreelectrical connections within the packaging substrate 252.

In some embodiments, the shielding-component 130 can be a functionalcomponent such as an RF filter device. Examples of such a functionalcomponent and use of the same for providing RF shielding functionalitiesare described herein in greater detail.

FIGS. 12A-12E show an example of how an opening formed through anovermold layer can allow formation of an electrical connection (510 inFIG. 11) between a conductive layer 532 of an RF module and a conductivelayer of a functional component 130.

As described herein, the functional component 130 can include a device(active or passive) that is part of the module's RF design and thereforeprovides some RF-related function. A device such as a CSSD (chip sizeSAW (surface acoustic wave) device) filter can be such a functionalcomponent.

Similar to FIG. 10A, FIG. 12A depicts a sectional view of an examplefunctional component 130. In the example shown, the functional component130 is shown to be inverted so that a metal layer 228 is facing upward.

Some or all of example through-die conductive vias 222 a-222 d can beelectrically connected to the metal layer 228. Some of such through-dieconductive vias can be electrically connected to one or more contactpads 226 formed on now-bottom-facing surface of the functional component130. Some of such contact pads 226 can be electrically connected to acircuit formed within the functional component 130 (e.g., signal input,signal output, power).

Similar to FIG. 10B, FIG. 12B shows a mounted configuration where theinverted die 130 is mounted on a packaging substrate 252. In someembodiments, the packaging substrate 252 can include contact pads (e.g.,254 a, 254 b, 254 c) to facilitate physical mounting (e.g., by solders)and electrical connections with their respective contact pads (e.g., 226a, 226 b, 226 c) of the die. The contact pads 254 a, 254 b, 254 c can beelectrically connected to their respective module-terminals ormodule-ground through various connection features (not shown) within thepackaging substrate 252 (e.g., a laminate substrate).

As further shown in FIG. 12B, the vias (e.g., 222 a, 222 b, 222 d) thatare not connected in the foregoing manner can be electrically groundedby, for example, ball joints 256 that are in turn electrically connected(not shown) to the module-ground. Accordingly, the metal layer 228 iselectrically connected to the module ground through some or all of theconductive vias. In some embodiments, such a module-ground can includeone or more ground planes that provide RF shielding functionality belowthe surface of the packaging substrate 252.

FIG. 12C shows an example configuration where an overmold 262 has beenformed over the packaging substrate 252 and covers the metal layer 228of the inverted die 130. Thus, for the example configuration shown inFIG. 12C, a conductive layer (not shown) formed over the overmold 262will not be in direct electrical contact with the metal layer 228.

FIG. 12D shows an example configuration 520 where an opening 522 hasbeen formed through a portion of the overmold 262 over the metal layer228. The opening 522 can be formed so as to yield an exposed surface 524on an upper portion of the metal layer 228. Such an opening can beformed utilizing a number of techniques, including, for example, laserdrilling or ablation. An example of formation of such an opening bylaser ablation is described herein in greater detail. Although describedin such a context, it will be understood that other opening-formationtechniques (e.g., mechanical drilling or chemical etching) can also beutilized.

FIG. 12E shows an example configuration 530 where a conductive layer 532has been formed over the overmold 262 and the opening 522. In someembodiments, the conductive layer 532 can provide contiguous coverageamong a region around the opening 522, the wall of the opening 522, andthe surface 524 of the metal layer 228 exposed by the opening 522.Accordingly, the conductive layer 532 as a whole can be in electricalcontact with the metal layer 228, and thereby with the grounding plane(not shown) of the module.

FIGS. 13A-13F show an example of how laser ablation can be utilized toform an opening through an overmold to facilitate an electricalconnection between a conductive layer of a module and a metal layer of afunctional component. FIG. 13A shows an example configuration where afunctional component 130 such as a filter device and ashielding-wirebond 106 are mounted on a packaging substrate 252.Although described in the context of both of the functional component130 and the shielding-wirebond 106 being implemented together, it willbe understood that one or more features associated with formation of theelectrical connection through a portion of an overmold can also beimplemented without the shielding-wirebond 106. It will also beunderstood that the functional component 130 includes an upper metallayer (e.g., 228 in FIG. 12).

FIG. 13B shows an example stage of module fabrication where an overmold262 has been formed over the packaging substrate 252. The overmold 262is shown to substantially encapsulate the shielding-wirebond 106. Anupper surface 540 of the overmold 262 may or may not expose a topportion (58 in FIG. 13C) of the shielding-wirebond 106.

In the example shown, the height of the shielding-wirebond 106 isgreater than the height of the functional component 130. Accordingly,the overmold 262 is shown to cover the upper surface of the functionalcomponent 130.

FIG. 13C shows an example stage where material has been removed from theupper surface (540 in FIG. 3B) so as to yield a new upper surface 542.The amount of material removed can be selected so that the top portion58 of the shielding-wirebond 106 is exposed sufficiently to allowelectrical connection with a conductive layer formed on the new uppersurface 542. In some implementations, such removal of material can beachieved by micro-ablation.

FIG. 13D shows a stage 550 where a laser beam 554 is applied to a regionabove the functional component 130 so as to ablate the overmold materialand form an opening 552. In some implementations, the overmold materialcan include, for example, epoxy molding compounds (EMCs). For such anexample material, a laser having a wavelength in a range of, forexample, 355 nm to 1060 nm can be utilized to form the opening.

In some implementations, the laser beam 554 can be applied until anupper surface 556 (e.g., a metal layer) of the functional component 130is exposed sufficiently to form an electrical connection. With theforegoing example laser, the beam at the operating power can generallyreflect from the metal surface 556. Accordingly, likelihood of over-burnsubstantially into or through the metal layer can be reduced.

In some implementations, the laser beam 554 can be focused to provide,for example, a desired lateral beam size at the ablation location. Sucha focused beam can have a conical shape, thereby resulting in theopening 552 having a chamfered wall that forms a greater-than-90-degreeangle with the upper surface 542. Such a chamfered profile canfacilitate an improved coverage of a conductive layer to be formed.

FIG. 13E shows an example stage 560 where the opening 552 formed bylaser can be cleaned to, for example, remove laser-ablation residue onthe surface 556. In some implementations, such cleaning can be achievedby micro-ablation similar to the micro-ablation example of FIG. 13C.

In some implementations, the entire module (and in situations where anarray of modules are being fabricated in a panel, the entire panel) canbe subjected to the micro-ablation process to clean the opening 552.Such an exposure to micro-ablation can result in overmold material beingremoved further so as to yield a new surface 544. In someimplementations, about 1 to 5 μm of the overmold material can be removedduring such a micro-ablation process.

In the example stages (FIGS. 13C and 13E) where micro-ablation processesare performed, it will be understood that the example figures are notnecessarily drawn to scale. Thus, the micro-ablation process associatedwith FIG. 13E can remove more or less amount of the overmold materialthan that of FIG. 13C.

FIG. 13E shows that such further removal of overmold material furtherexposes the shielding-wirebond 106. In some implementations, such anincrease in exposed portion of the shielding-wirebond 106 can facilitatean improved electrical connection with a conductive layer to be formed.

In some implementations, a rinse process can be implemented to removeresidue from the micro-ablation process and to prepare the surfaces(544, 556) of the overmold 262 and the exposed metal layer of thefunctional component 130.

FIG. 13F shows an example stage 570 where a conductive layer 572 hasbeen applied so as to substantially cover the overmold surface 544, thewall 558 of the opening 552, and the exposed metal surface 556 of thefunctional component 130. The conductive layer 572 is also shown to havecovered the exposed upper portion of the shielding-wirebond 106. Thus,the conductive layer 572 is now electrically connected to the groundplane (not shown) through the shielding-wirebond 106 and the functionalcomponent 130.

In some implementations, the conductive layer 574 can include metallicpaint applied by spraying. Various examples of such a metallic paint aredescribed in greater detail in, for example, US Patent ApplicationPublication No. 2013/0335288, titled SEMICONDUCTOR PACKAGE HAVING AMETAL PAINT LAYER the disclosure of which is incorporated herein byreference in its entirety.

FIG. 14 shows a process 600 that can be implemented to effectuate theexample module-fabrication stages described in reference to FIGS.13A-13F. In block 602, a functional component can be mounted on apackaging substrate. In block 604, one or more shielding-wirebonds canbe formed relative to the functional component. In block 606, anovermold structure can be formed to encapsulate the functional componentand the shielding-wirebonds. In block 608, a first ablation process canbe performed to expose upper portions of the shielding-wirebonds. Insome implementations, such an ablation process can include amicro-ablation process. In block 610, an opening can be formed throughthe overmold to expose at least a portion of a metal layer of thefunctional component. In some implementations, such an opening can beformed by laser ablation. In block 612, a second ablation process can beperformed to further expose the shielding-wirebonds and to removeresidue from the surface of the exposed metal layer of the functionalcomponent. In some implementations, such an ablation process can includea micro-ablation process. In block 614, the exposed surfaces of theovermold and the metal layer surface can be can be cleaned. In block616, an upper conductive layer can be formed to cover the exposedportions of the shielding-wirebonds and the exposed portion of the metallayer of the functional component. In some implementations, the upperconductive layer can be formed by spray-application of metallic paint.

In some implementations, additional details concerning some of theexample stages of FIG. 13 and the process blocks of FIG. 14 can be foundin US Patent Application Publication No. 2013/0335288. It will beunderstood, however, that one or more features of the present disclosurecan also be implemented with other configurations. For example, removalof overmold material does not necessarily need to be performed bymicro-ablation. In another example, formation of the upper conductivelayer does not necessarily need to be performed by spray-application ofmetallic paint.

In the various examples described herein, the openings (522 in FIGS. 12,and 552 in FIG. 13) are described in the context of one opening beingformed over the functional component (130). It will be understood thatmore than one opening can be formed and utilized to facilitate more thanone electrical connection between the upper conductive layer and thefunctional component. For example, if a given functional component has arelatively large lateral dimension, it may be desirable to form aplurality of such electrical connections.

FIG. 15A shows a plan view of a functional component 130 encapsulated byan overmold 262. One opening (522, 552) is shown to be formed so as tofacilitate an electrical connection as described herein. Such an openingmay or may not be centered with respect to the functional component 130.

FIG. 15B shows an example configuration where a plurality of openings(522, 552) are formed over the functional component 130. In someembodiments, such openings can be generally aligned along a selectedline.

FIG. 15C shows that in some embodiments, a plurality of openings (522,552) can also be arranged laterally in two dimensions. For example, theopenings can be arranged in a two dimensional array.

In the various examples herein, a conformal conductive layer (e.g., 572in FIG. 13F) and its contact with an exposed metal surface of an SMD(e.g., 130) are described in the context of formation of an electricalconduction path to facilitate the grounding path between the conformalconductive layer and a ground plane of the packaging substrate. However,it will be understood that one or more features associated with such aconformal layer formed so as to be in contact with an upper surface ofthe SMD can also be utilized to provide other conduction paths betweenthe SMD and the conformal layer. For example, heat can be transferredfrom the SMD through its upper surface and to the conformal layerthrough conduction. In such an application, either or both of theconformal layer and the upper surface of the SMD can be configured toprovide good thermal conduction properties, and may or may not includeelectrical conduction properties.

For the purpose of description herein, a surface mount device (SMD) caninclude any device mountable on a substrate such as a packagingsubstrate utilizing various surface mount technologies. In someembodiments, an SMD can include any device mountable on a packagingsubstrate and having an upper surface. In some embodiments, such anupper surface can be larger than an upper portion of a curved wirebond.An SMD can include active and/or passive components; and such componentscan be configured for RF and/or other applications. Such an SMD is alsoreferred to herein as, for example, an RF component, a component, afilter, a CSSD, a shielding-component, a functional component, and thelike. It will be understood that such terms can be used interchangeablyin their respective contexts.

In some implementations, a device and/or a circuit having one or morefeatures described herein can be included in an RF device such as awireless device. Such a device and/or a circuit can be implementeddirectly in the wireless device, in a modular form as described herein,or in some combination thereof. In some embodiments, such a wirelessdevice can include, for example, a cellular phone, a smart-phone, ahand-held wireless device with or without phone functionality, awireless tablet, etc.

FIG. 16 depicts an example wireless device 700 having one or moreadvantageous features described herein. In the context of a modulehaving one or more features as described herein, such a module can begenerally depicted by a dashed box 100, and can be implemented as afront-end module (FEM). Other modules in the wireless device 700 canalso benefit from implementation of one or more features as describedherein.

PAs 712 can receive their respective RF signals from a transceiver 710that can be configured and operated to generate RF signals to beamplified and transmitted, and to process received signals. Thetransceiver 710 is shown to interact with a baseband sub-system 708 thatis configured to provide conversion between data and/or voice signalssuitable for a user and RF signals suitable for the transceiver 710. Thetransceiver 710 is also shown to be connected to a power managementcomponent 706 that is configured to manage power for the operation ofthe wireless device. Such power management can also control operationsof the baseband sub-system 708 and the module 100.

The baseband sub-system 708 is shown to be connected to a user interface702 to facilitate various input and output of voice and/or data providedto and received from the user. The baseband sub-system 708 can also beconnected to a memory 704 that is configured to store data and/orinstructions to facilitate the operation of the wireless device, and/orto provide storage of information for the user.

In the example wireless device 700, outputs of the PAs 712 are shown tobe matched (via respective match circuits 714) and routed to an antenna722 through a band selection switch 716, their respective duplexers 718and an antenna switch 720. In some embodiments, each duplexer 718 canallow transmit and receive operations to be performed simultaneouslyusing a common antenna (e.g., 722). In FIG. 16, received signals areshown to be routed to “Rx” paths (not shown) that can include, forexample, one or more low-noise amplifiers (LNAs).

A number of other wireless device configurations can utilize one or morefeatures described herein. For example, a wireless device does not needto be a multi-band device. In another example, a wireless device caninclude additional antennas such as diversity antenna, and additionalconnectivity features such as Wi-Fi, Bluetooth, and GPS.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While certain embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A method for fabricating a radio-frequencymodule, the method comprising: providing a packaging substrate, thepackaging substrate configured to receive a plurality of components, thepackaging substrate including a ground plane; mounting a surface mountdevice on the packaging substrate; and forming or providing a conductivelayer over the surface mount device such that the surface mount deviceelectrically connects the conductive layer with the ground plane tothereby provide radio-frequency shielding between first and secondregions about the surface mount device.
 2. The method of claim 1 whereinmounting the surface mount device includes inverting the surface mountdevice from its designed usage orientation, the surface mount deviceincluding a conductive feature that faces upward and in electricalcontact with the conductive layer in the inverted orientation.
 3. Themethod of claim 1 wherein the first region is on the packagingsubstrate, and the second region is outside of the module.
 4. The methodof claim 1 wherein each of the first and second regions is on thepackaging substrate.
 5. The method of claim 1 wherein the surface mountdevice includes a functional component.
 6. The method of claim 5 furthercomprising: implementing an upper connection feature of the functionalcomponent in electrical contact with the conductive layer; implementinga lower connection feature of the functional component in electricalcontact with the ground plane; and configuring at least oneinterconnection feature to electrically connect the conductive layerwith the ground plane.
 7. The method of claim 6 wherein the functionalcomponent includes a functional die such that the upper connectionfeature includes a metal layer formed on one side of the die.
 8. Themethod of claim 7 wherein the at least one interconnection featureincludes at least one through-die conductive via.
 9. The method of claim8 wherein the lower connection feature includes a contact feature thatelectrically connects the through-die conductive via with the groundplane.
 10. The method of claim 9 wherein the die includes aradio-frequency filter.
 11. The method of claim 10 wherein theradio-frequency filter is a chip size surface acoustic wave (SAW) device(CSSD).
 12. The method of claim 10 further comprising mounting the dieon the surface of the packaging substrate in an orientation that isinverted relative to its designed usage orientation.
 13. The method ofclaim 1 further comprising implementing a plurality ofshielding-wirebonds relative to the surface mount device, the pluralityof wirebonds configured to provide the radio-frequency shielding incombination with the surface mount device.
 14. The method of claim 13further comprising positioning the surface mount device on the packagingsubstrate to provide shielding along a segment that would otherwise beshielded by one or more shielding-wirebonds.
 15. The method of claim 14further comprising implementing a conductive racetrack under theplurality of shielding-wirebonds, the conductive racetrack electricallyconnected to the shielding-wirebonds and a ground plane within thepackaging substrate.
 16. The method of claim 15 further comprisingpositioning the surface mount device along an edge of the packagingsubstrate.
 17. The method of claim 16 wherein a portion of the edgeoccupied by the surface mount device is substantially free of theconductive racetrack.
 18. The method of claim 1 further comprisingforming a radio-frequency shield relative to the surface mount device,the radio-frequency shield including a plurality of shielding wirebondsand at least one shielding-component, the at least one shieldingcomponent configured to replace one or more shielding wirebonds.
 19. Themethod of claim 18 wherein forming the radio-frequency shield includesmounting the at least one shielding-component in a position along aselected edge of the packaging substrate.
 20. A wireless devicecomprising: an antenna; and a module in communication with the antenna,the module configured to facilitate processing of an RF signal throughthe antenna, the module including a packaging substrate configured toreceive a plurality of components, the packaging substrate including aground plane, the module further including a conductive layerimplemented over the packaging substrate, the module further including asurface mount device (SMD) mounted on the packaging substrate, the SMDconfigured to electrically connect the conductive layer with the groundplane to thereby provide RF shielding between first and second regionsabout the SMD.